| Customization: | Available |
|---|---|
| Type: | Flexible Circuit Board |
| Dielectric: | FR-4 |
|
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| Name: | FPC Process Capability |
Number of Layers |
Single Sided, Double Sided, Multilayer,Rigid-flex PCB |
Based Material |
PI, PET |
Certificate: |
OHSAS18001:2007,ISO14001:2004,ISO/TS16949:2009, ISO13485:2003,TUV,UL,SGS,ROHS,FCC,CCC,CE,ASTM-F963-16 |
| Custom Made: | OEM/customize |
| Flexible layers | 1~8layer |
| Minimum Trace and Space | 12&18um(base Cu):0.075/0.075mm ;35um(base Cu):0.1/0.1mm |
| Minimum Space Betw en
Coverlay Openings |
0.2mm |
| Minimum Space between
coverlay and solder pad |
0.15mm |
| Polyimide Films | 0.5 mil (12.5), 1 mil (25), 2 mils (50), 3 mils (75),
4mils(100), 5 mils(125) as custmer requested |
| Thermobond Adhesives | Acrylic/Modified Acrylic, Modified Epoxy, Polyimide |
| Copper Foils (RA or ED) | 1/3oz (12), 1/2oz (18), 1oz (35), 2oz (70) |
| Surface Finish | Electroless Ni/Au, Electrolytic soft/hard gold,
Tin plating,,Imm.Tin,Entek/OSP |
| Solder Resists | Coverlay, Photo-Imagable Resist |
| Copper Plated Thickness(PTH only) | 8~15um;20~30um;30~70um(special) |
| Minimum space between
coverlay and conductor |
± 0.15mm |
| Minimum conductor edge to
outline edge |
≥0.1mm |
| Au thickness |
Electroless Ni/Au Ni:2~6um;Au:0.035~0.075um Electrolyticsoft/hardgoldNi:2~9um;Au:0.035~0.1um |
| Smallest Drill Size | 0.2mm |
| Largest Drill Size | 6.3 |
Rigid Flex
A blend of rigid and flex emphasizing the best of both constructions, adding complimenting capabilities that neither possess alone. In its most typical configuration, the rigid-flex is as a series of rigid PCBs joined by integrated flex circuits (with emphasis on the high percentage of rigid area content). There are many excellent possibilities for circuits designed primarily as a flex circuit with the addition of integrated rigid areas. The rigid areas provide excellent hard mount points for components, connectors and chassis while flex areas offer dynamic flexing, flex to fit, and component mounting poised to take advantage of these low mass and vibration resistant zones. This blending leads to creative solutions for your most demanding applications.
Multilayer Flex
Multilayer flex circuits offer exceptional performance and reliability in situations where the circuit is exposed to excessive vibration or shock combined with frequent bending or folding. Multilayer technology allows high circuit density connections to be achieved in applications where one or two layers of conductors could not meet the required circuit packaging requirements. Additionally, multilayer flex circuits provide increased functionality with a smaller footprint.
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